The 2007 annual evaluation of China's semiconductor innovative products and technologies, conducted jointly by China Semiconductor Industrial Association, China Electronic materials industrial association, China Electronic Equipment Industrial Association, and China Electronics Journal, was recently concluded with the announcement of 35 innovative products and technologies, among which is the semiconductor innovative technology of 0.162-micrometer CMOS technology of HeJian Technology of SIP.

The year 2007 saw the sustained fast development of semiconductor industry in China and the emergence of a good number of innovative products and technologies in the course of semiconductor industrialization. The recent evaluation is the second annual event aimed to foster new products and technologies under the guidance of Ministry of Information Industry.

All the innovative products and technologies eligible for evaluation are results of research and development by enterprises registered in China with independent IPR or related patent rights in the year between 2006 and 2007 and mature application in industrialization.

HeJian Technology is an advanced wafer-level IC chip manufacturer in SIP that began operation in May 2003 with a total investment of USD 1.6 billion and a maximum monthly production capacity of 60,000 chips. The company has now completed its first step in strategic deployment of IC industry in mainland China by bringing into SIP a cluster of upstream and downstream industries, and is now planning to build more wafer-level chip manufacturing facilities.